Electronics soldering flux facilitates the soldering process. One of the obstacles to a successful solder joint is an impurity at the site of the joint, for example, dirt, oil or oxidation. The impurities can be removed by mechanical cleaning or by chemical means, but the elevated temperatures required to melt the filler metal (the solder) encourages the work piece (and the solder) to re-oxidize. This effect is accelerated as the soldering temperatures increase and can completely prevent the solder from joining to the workpiece.
The most common type of electronics soldering flux used in electronics is rosin-based, made of rosin drawn from pine trees. It was ideal in that it was non-corrosive and non-conductive at normal temperatures but became mildly reactive (corrosive) at the elevated soldering temperatures. Plumbing and automotive applications, among others, typically use an acid-based flux which provides cleaning of the joint. These fluxes cannot be used in electronics because they are conductive and because they will eventually dissolve the small diameter wires. Many fluxes also act as a wetting agent in the soldering process, reducing the surface tension of the molten solder and causing it to flow and wet the work pieces more easily.soldering
Array Solders No Clean Flux
AS-No Clean is a low residue, organic based, halide free flux. Since it leaves small amounts of noncorrosive, non-tacky residue that will not interfere with in circuit or automated pin testing. Therefore, used AS-No Clean reduces production costs. Furthermore, the leftover residue does not have to be cleaned. AS-No Clean is rosin free and contains a small amount of solids.
Array Solders Rosin Flux
AS-Rosin is non-activated flux made of isopropyl alcohol and pure water white gum rosin. What’s more – It can be used on electronic assemblies where flux residue removal is not possible. The flux residue is non-corrosive, non-conductive, and non-hygroscopic, thus can be left on. If cleaning or removal of the residue is necessary, it can be accomplished using saponifier in an aqueous cleaning system. It also meets J-STD-004 Type ROLO.
Array Solders Rosin Mildly Activated
AS-RMA is made to meet the demands of high-speed soldering applications. It can be applied by waving, brushing, dipping and foaming. AS-RMA exhibits superior foaming characteristics with a uniform stable foam head. It is excellent for tinning stranded wire as well as component leads and attaching lead frames to hybrid circuit assemblies. It meets the requirements of type rma as per MIL-F-14256. Additionally, it classifies as ROM1 in JTD-004.