In addition to producing a complete spectrum of solder materials, Array Solders also creates gold preforms for die attach and lid seal applications. It should be noted that gold germanium (88au/12ge) and gold tin (80au/20sn) are eutectic alloys, meaning their melting and solidification points are both 278°C. High temperature solders 80au20sn and 88au12ge can also be categorized as brazing alloys.
Gold Tin Facts (80au/20sn)
- 40,000 PSI shear strength
- 278°C melting point (eutectic)
- Excellent thermal fatigue properties
- Excellent sealing
- RoHS compliant
- Resistant to alkaline corrosion
- High thermal conductivity 0.57 W/cmC @ 85°C
- Low thermal coefficient of expansion 16ppm/cmC @ 85°C
Available Forms
- Washers
- Ribbon
- Lids
- Rectangles
- Squares
- Discs
- Customized
Gold Germanium Facts (88au/12ge)
- 356°C melting point
- Excellent creep resistance
- Excellent thermal conductivity
- 185000 tensile strength
- CTE, linear 7.22 µin/in-°F @Temperature
Gold Preforms are Used in the Following Applications
- Heat sinks
- Lead frames
- Microelectronic packaging
- Lead pins
- Wetting Laser Optics
- Sealing laser optics
- Thermal interfaces
Gold Preforms Process Advantages
- Typically gold preforms does not require any flux or chemical acid etch treatment
- Flows well on gold plated substrates
- Does not scavenge gold
- Excellent cosmetic appearance
- Gold preforms can be tack welded onto lids so that lids can be obtained with positioned preforms called combo lids
Available in the Following Forms
- Washers
- Ribbon
- Lids
- Rectangles
- Squares
- Discs
- Customized
- Wire
Please note that minimum thickness differs depending on the dimensions and characteristics of the preform in question.